Scope of IMAPS

Hybrid and Semiconductor Technologies

Design Methods and Computer Simulations

Electronic Materials and Components

Microcircuits Applications

Thick-Film and Thin-Film Technologies

Sensors and Sensing Materials

Packaging and PCB Technologies

Quality and Reliability Evaluation

Thermal Management

Scope of COE

Theory, modelling and design of sensors, transducers and actuators

New materials and technologies for sensors, micro and nanosystems

Physical quantities sensors

Environmental sensors

Sensors and miniaturised systems for space exploration and medicine

Quantum sensors

Electrochemical, semiconductor and electrocatalytic gas sensors

Biosensors and lab-on-chips

Optoelectronic sensors, fiber optic and image converters

MEMS, optical MEMS, RF MEMS, NEMS

Sensory networks, transmission systems, Internet of Things, Industry 4.0

Applications and metrological aspects of sensors and microsystems

Value

tn_a1 (1)

For authors

Please send via e-mail
imaps2026@imif.lukasiewicz.gov.pl
a two-page extended abstract according to instructions placed in the template file.

Abstract Submission Guidelines

Authors are kindly requested to prepare a two-page abstract using the official template provided by the conference organizers. The template can be downloaded from the link available below.

Please ensure that the abstract  follows the formatting requirements specified in the template before submission.

Submission Deadlines
Participants are kindly requested to submit their abstracts by June 5.
Authors will be informed about the acceptance of their abstracts by June 15.
Reduced early bird registration fees will be available for participants who complete their payment by June 20.
The final deadline for payment is July 15.

 

  • Abstract submission deadline: June 5
  • Notification of abstract acceptance: June 15
  • Early bird payment deadline: June 20
  • Payment deadline for participants with accommodation: July 15

 

Conference Participation Fees – IMAPS Poland & COE 2026
Participation Type
Early Bird Fee
Regular Fee
Notes
Participants conference without accommodation
1500 PLN
 Includes participation in all conference sessions as well as all meals throughout the conference
Single Room
3200 PLN
Double Room
2800 PLN
Student / PhD – Double Room
IMAPS 
2400 PLN
The Early Bird offer is limited to 20 participants IMAPS of Poland Conference and will be granted in the order of registration. Accommodation is available in double rooms only.
Student / PhD – Double Room
COE
2400 PLN
The Early Bird offer is limited to 5 participants of COE Conference and will be granted on a competitive basis, based on the evaluation of submitted abstracts. Accommodation is available in double rooms only.
Exhibitor
4500 PLN
Includes exhibition stand

Early Bird payment deadline: June 20, 2026.

Registration for conference participation without accommodation is now open. If additional hotel rooms become available, we will announce this promptly on the IMAPS/COE website.

Payment Details

Please find the payment details for participation in the IMAPS/COE 2026 Conference. The applicable fees are available in the table above. Please transfer the registration fee according to your status (PhD/Student/Regular, Single/Double Room) and payment date, using the following details:
Bank account:
PLN:   60 1140 1081 0000 5580 4500 1029   mBank S.A
Adress:
Sieć Badawcza Łukasiewicz – Instytut Mikroelektroniki i Fotoniki
al. Lotników 32/46 02-668 WarszawaFor international PLN transfers:
IBAN no: PL60 1140 1081 0000 5580 4500 1029

Swift code: BREXPLPWXXX
IMPORTANT!!! 

In the payment reference (title), please include:

Participant’s full name and surname , ID number, Conference (COE or IMAPS)

Publication Opportunity for IMAPS Participants

Participants of this year’s IMAPS conference will have the opportunity to submit extended versions of their contributions to two Special Issues:

  • Sensors (MDPI) – “Passive RFID Technology: Integrated Communications and Sensing”
    (Impact Factor: 3.5, CiteScore: 8.2) More Details
  • Circuit World (Emerald) – “Advanced Materials and Technologies for High-Reliability Electronic Systems”
    (Impact Factor: 0.7, CiteScore: 3.1)

These Special Issues provide an excellent platform to further develop and disseminate high-quality research presented at the conference.

Committees

Discover our teams

IMAPS Scientific Committee
COE Scientific Committe
Organizing Committee

News

Latest news about the conference

Contact Us

Send message

If you have any questions, please send us a message at the provided email address.

Map